Die Montage solcher Systeme kann zumindestens teilweise auf Wafer Level erfolgen.
Dafür bieten sich Pick&Place-Technologien an, die Technologiekonvergenz zwischen Optik- und Elektronikfertigung kann so vorangetrieben werden.
www.iof.fraunhofer.deThe assembly of optical systems integrated that way can be carried out at least partially on wafer level.
Therefore pick&place technologies can be adapted, thus merging manufacturing of optics and electronics further.
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